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Technology

The telecom and data processing industries are facing many of the same challenges as they move aggressively to increase performance and functionality of their equipment. One key element continues to pose problems - how to provide sufficient power to meet the needs of ever increasing power hungry equipment. Constantly lowering, multiple voltages followed by power quality are also becoming a major issue.

Chippower's technology has been designed specifically to meet these needs. The following charts highlight the key power issues facing both these industries and how the Chippower technology not only meets but also surpasses industry requirements.

Telecom Industry:

Key Power Issues: (In order of priority)

  1. Space occupied by power components on equipment boards, currently up to 40% of board surface
  2. Reliability and hot insertion
  3. Increasing density of circuitry and applications is driving need for higher power requirements;
  4. Efficiency levels must be high to minimize heat dissipation in high density applications;
  5. Voltage levels continue to drop to increase equipment throughput and bandwidth;
  6. Multiple voltages followed by proper voltage sequencing requirements;
  7. Power responsiveness to satisfy Gigabit plus processor requirements;
  8. Need for cost savings directly related to power components is minimal.

Data Processing Industry

Key Power Issues: (In order of priority)

  1. Performance to meet Gigabit plus processor response requirements;
  2. Need for high efficiency levels to minimize heat dissipation in high density, high performance applications;
  3. Voltage levels continue to decline into sub-volt levels, while current levels increase toward 60A;
  4. Space and profile of converters must be miniaturized to meet equipment design, board layout and reduce cooling requirements.


Chippower Solution

Industry
Requirement
Competitive
Solution
Chippower
Solution
Impact
Power space on board Evolution from brick to brick; 1/8th brick announced, no product available. Technology requires 1/16th brick on board Board space savings of up to 75%
High power Requirements bricks provide 15-20A solutions; need to go to bricks for higher current; 1/8th bricks estimated at 15A 1/16th brick can provide a power range up to 20A Module design which can be used in wide variety of applications - minimize board redesign
Efficiency levels Projected in 80% range Proven at 90% 2 times reduction in heat dissipation
Voltage levels Industry levels range from 3.3V to 1.2V Designed for 1.5V to sub-volt requirements Increased equipment functionality
Responsiveness Standard 5A/s; to improve need to add decoupling capacitors which occupy more space on board Standard 1000A/s - decoupling capacitors reduced by 90% Ability to meet need of Gig+ processors; reduced complexity of power design; more available board space.
Footprint and profile Standard brick - 1/8 brick not true sizing 1/16th brick footprint - less than 0.5" height Enables high density board placement; reduces cooling requirements


 

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